It is a new bond implementation, but it is configured almost 4 months ago.
It's stable, except these 3 moments when VSs interfaces changes was made.
Here is ethtool info, it is identical on all involved interfaces (10Gb SFP+)
[Expert@fw2:0]# ethtool -i eth1-04
driver: net_ice
version: DPDK 20.11.7.4.0 (29 Mar 24)
firmware-version: 4.20 0x800178e2 1.3346.0
expansion-rom-version:
bus-info: 0000:17:00.7
supports-statistics: yes
supports-test: no
supports-eeprom-access: no
supports-register-dump: no
supports-priv-flags: yes
From both sides lacp rate is slow/normal
fw2:0> show bonding group 4
Bond Configuration
xmit-hash-policy layer2
down-delay 200
primary Not configured
lacp-rate slow
mode 8023AD
up-delay 200
mii-interval 100
min-links 0
Bond Interfaces
eth1-04
eth3-04
#### edit
There is something that just remember - bond in CP device is created with one port from Line card 1 model: CPAC-8-1/10F-D and second port from: Line card 3 model: CPAC-4-10/25F-D
There is difference in firmware, but driver is the same:
[Expert@fw2:0]# ethtool -i eth1-03
driver: net_ice
version: DPDK 20.11.7.4.0 (29 Mar 24)
firmware-version: 4.20 0x800178e2 1.3346.0
expansion-rom-version:
bus-info: 0000:17:00.5
supports-statistics: yes
supports-test: no
supports-eeprom-access: no
supports-register-dump: no
supports-priv-flags: yes
[Expert@fw2:0]# ethtool -i eth3-04
driver: net_ice
version: DPDK 20.11.7.4.0 (29 Mar 24)
firmware-version: 4.30 0x8001b94f 1.3415.0
expansion-rom-version:
bus-info: 0000:b1:00.2
supports-statistics: yes
supports-test: no
supports-eeprom-access: no
supports-register-dump: no
supports-priv-flags: yes