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15xxx appliance [GAIA]: Bond with SYNC interface and module interface?

Hi board,

Does anyone knows if following scenario is an option? (Unfortunately, I cannot test in advance)

On a 15xxx appliance, creating a bond interface with 2 interfaces, the physical SYNC interface and another interface located on one of the modules?

Both bond members are 1Gbps/copper.

Is there something special with the SYNC interface which should thwart the bond creation?

Many thanks!

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